Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

摘要

A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mounted to the first stiffener surface within the central opening through the frame body. A planar lid has opposing first and second surfaces. The second lid surface is coupled to the first frame body surface. A first substrate surface is coupled to a second stiffener surface. An array of electrically conductive terminals is coupled to a second substrate surface. The stiffener, frame body, and lid form an enclosure structure substantially enclosing the IC die. The die enclosure spreads heat from the IC die, and shields EMI emanating from and radiating toward the IC die.