发明名称 ADHESIVE SHEET, METHOD FOR PRODUCING THE SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND THE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive sheet worked by pre-cut processing and capable of enough controlling insufficiency of release of an adhesive layer, a pressure-sensitive adhesive layer, and a base film from a release base. SOLUTION: This adhesive sheet has such a structure that the release base, the adhesive layer, the pressure-sensitive adhesive layer, and the base film are sequentially laminated, wherein the adhesive layer has a prescribed first planar shape and is partially formed on the release base, the release base has a first notched part which is formed along the periphery of the first planar shape from a surface on a side attaching to the adhesive layer, and a notched depth of the first notched part is less than a thickness of the release base and not more than 25μm. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005350520(A) 申请公布日期 2005.12.22
申请号 JP20040170455 申请日期 2004.06.08
申请人 HITACHI CHEM CO LTD 发明人 MATSUZAKI TAKAYUKI;FURUYA SUZUSHI;URUNO MICHIO;MASUNO MICHIO;KANEDA MAIKO;INADA TEIICHI
分类号 C09J7/02;C09J5/00;C09J201/00;H01L21/301;(IPC1-7):C09J7/02 主分类号 C09J7/02
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