| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that even a hole-filled board has been distorted by its supporting plate for filling holes being distorted largely when filling its holes with resin pastes. SOLUTION: In resin-paste filling processes for filling with resin pastes through holes 2b formed in a hole-filled board 2 wherein a plurality of product forming regions 21 are provided, the through holes 2b present in each product forming region 21 of the hole-filled board 2 are grouped into a plurality of groups. Then, the hole-filled board 2 is supported by a supporting plate 1 for filling holes wherein releasing holes 1a for releasing the resin pastes are bored correspondingly to each group. COPYRIGHT: (C)2006,JPO&NCIPI |
