| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor component where individual semiconductor chips can be rearranged so that they are in prescribed positions with respect to a desired substrate without taking them from the substrate, and to provide a manufacturing method of the component. SOLUTION: In the mounting method of the semiconductor component 20, the semiconductor component 20 is heated where at least a part of the semiconductor chip 12 is brought into contact with the substrate 11 formed of synthetic resin. A part of or the whole substrate 11 is liquefied. The semiconductor component 20 formed of the semiconductor chip 12 and of a part of or the whole substrate 11 in a liquefied state is ejected to an adherend 40. A part of or the whole liquefied substrate 11 is used and the semiconductor component 20 is made to adhere to the adherend 40. COPYRIGHT: (C)2006,JPO&NCIPI
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