发明名称 |
Chemical mechanical polishing slurry useful for tunsten/titanium substrate |
摘要 |
Disclosed is a chemical mechanical polishing (CMP) slurry having a superior polishing efficiency as well as being capable of effectively converting a metal layer to be polished into a metal oxide layer. The CMP slurry composition includes an abrasive, an oxidizing agent, an iron-doped colloidal silica, and water. Preferably, the amount of the iron-doped colloidal silica is 0.0001 to 0.5 weight % with respect to the total CMP slurry composition, and the iron-doped colloidal silica is produced by reacting a silica salt with an iron salt in an aqueous solution state. The preferable amount of Si contained in the silica salt is 2 to 10 times of the amount of Fe contained in the iron salt by mole ratio.
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申请公布号 |
US2005282471(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20050153624 |
申请日期 |
2005.06.16 |
申请人 |
DONGJIN SEMICHEM CO., LTD. |
发明人 |
PARK JONG-DAI;KIM DONG-WAN |
分类号 |
B24B1/00;B24D3/02;C08H1/00;C09G1/02;C09K3/14;H01L21/321;(IPC1-7):B24D3/02 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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