| 摘要 |
<P>PROBLEM TO BE SOLVED: To reliably connect an integrated circuit chip with a wiring board by easily and uniformly supplying adhesives to a mounting area when the integrated circuit chip is mounted on the wiring board by using adhesives having flowability. <P>SOLUTION: In this method, an electronic circuit element 20 is manufactured in which a bare chip 10 is mounted on an FPC 5. This method comprises an adhering layer forming step of forming an adhering layer 9c in a mounting region 8 of the FPC 5, and a chip crimp step of crimping the bare chip 10 via the adhering layer 9c to the mounting region 8. The adhering layer forming step comprises an adhering part forming step which supplies a non-conductive paste 4 to the mounting region 8 of the FPC 5, for forming a plurality of adhering parts 9a at locations apart from each other; and a heating step of heating the plurality of adhering parts 9a, to reduce a viscosity of the adhering part 9a, thereby expanding each adhering part 9a in the mounting region 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
