| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the exchange time for substrates and to improve the throughput. <P>SOLUTION: The aligner is equipped with: a substrate stage 2 which is mounted on a moving table 3x movable in the axial direction and holds a substrate W as a material to be exposed; a mask stage 5 which holds a mask M having a pattern for exposure and allows the mask to oppose the substrate W when the moving table 3x stops at a predetermined position; and an irradiating means 6 which irradiates the mask M with exposure light so as to transfer the pattern of the mask M onto the substrate W by exposure. In the aligner, the moving stroke of the moving table 3x in the axial direction is controlled to be longer than the dimension of the substrate W in the axial direction and to be long enough to completely eject the substrate W from the mask M. The aligner is equipped with a substrate exchanging apparatus 10 which carries in and out the substrate W with respect to the substrate stage 2 at the position where the substrate W is located completely away out of the mask M. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
