| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to increase rigidity of a movable die suspension device without increasing thickness of a board of a mold mounting plate. SOLUTION: The movable die suspension device can be set forth with a movable die, which can receive a load caused by a driving force of a driving source. The device comprises a mold mounting plate 15 equipped with a mold mounting surface, a first load receiving part receiving the said load, and a second load receiving part, a load transmit member wherein the first end is connected to the said first load receiving plate and the second load receiving plate and the other end is connected to a back surface 20 of the said mold mounting plate 15 and the loads from the said first load receiving part and the said second load receiving part are transmitted to the back surface 20 of the said mold mounting plate 15, a tubular load receiving connecting part 41 which connects the first load receiving part to the second load receiving part. COPYRIGHT: (C)2006,JPO&NCIPI
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