| 发明名称 |
Deposition apparatus and method |
| 摘要 |
A deposition apparatus 10 a of this invention include an evaporation source 12 for evaporating materials by heating to deposit evaporant on a plurality of substrates 14 , wherein the evaporation source 12 is able to move near to at least two of the substrates 12.
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| 申请公布号 |
US2005281950(A1) |
申请公布日期 |
2005.12.22 |
| 申请号 |
US20050154408 |
申请日期 |
2005.06.16 |
| 申请人 |
KYOCERA CORPORATION |
发明人 |
TANAKA ATSUSHI;TSUJIMURA TAKATOSHI;MURAYAMA KOJI |
| 分类号 |
C23C14/12;C23C14/56;C23C16/00;H01L51/00;(IPC1-7):C23C16/00 |
主分类号 |
C23C14/12 |
| 代理机构 |
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