发明名称 INTEGRATED CIRCUIT AND METHODS OF MEASUREMENT AND PREPARATION OF MEASUREMENT STRUCTURE
摘要 A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.
申请公布号 US2005283335(A1) 申请公布日期 2005.12.22
申请号 US20050160086 申请日期 2005.06.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANKE G. W.JR.;DEERING ANDREW;KASZUBA PHILIP V.;MOSZKOWICZ LEON;ROBERT JAMES;SLINKMAN JAMES A.
分类号 A61M1/00;G01N1/32;G01Q30/04;G01Q30/20;G01R31/28;G06F19/00;H01L21/66;(IPC1-7):G06F19/00 主分类号 A61M1/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利