| 摘要 |
<p num="1"><br/><br/><br/>The invention relates to a sealant compound comprising, in weight percent <br/>relative to the compound total volume: 40-60 % of mineral filler whose <br/>diameter d50 ranges from 5 to 20 microns, 5-10 % of hydrophobic expanded <br/>perlite whose diameter d50 ranges from 20 to 100 microns and 4-20 % of binder <br/>A method for preparing the inventive compound is also disclosed. Said <br/>invention also relates to producing a work provided with joints made of <br/>pointing and/or surfacing compound by applying said compound and/or pointing <br/>and surfacing by applying the compound which is characterised in that the <br/>compound is applied by airless process. According to the inventive method, <br/>said sealant compound is embodied such as described in the invention.<br/>
|
