SEMICONDUCTOR SUBSTRATE, AND THINNING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate reliably protected from wafer cracks in the wafer thinning process, and to provide a thinning method for the semiconductor substrate. SOLUTION: An element region 11 with a semiconductor element formed thereon and a substrate peripheral region 10b different from the element region 11 are provided on the surface of a semiconductor 10. A rugged section 12 is formed on the substrate peripheral region 10b. COPYRIGHT: (C)2006,JPO&NCIPI