| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency device allowing a wide-range impedance adjustment without a wire attaching process, but suffering from but a low loss due to impedance mismatch. SOLUTION: In the high-frequency device having a substrate with wires arranged thereon, the wires include a first wire and a second wire connected to the first wire but formed apart from the first wire, with the second wire formed by fusing nano-scale wiring metal particles having a diameter of≤100 nm. COPYRIGHT: (C)2006,JPO&NCIPI |
