发明名称 Coating composition of positive photosensitive polyimide
摘要 A coating composition of positive photosensitive polyimide is disclosed, which includes an organic solvent and the following components dissolved in the organic solvent: (a) a polyimide having a phenolic hydroxyl group or carboxyl group at the end of a principal chain of the polymer; (b) a compound having a phenolic hydroxyl group; and (c) a quinonediazide sulfonate as a photosensitive agent. The amount of the components (b) and (c) are 1-50 parts by weight per 100 parts by weight the component (a) in the coating composition. A film of the coating composition can be developed with an alkaline aqueous solution, which has a high photosensitivity, excellent resolution, low post-cure temperature, high film residual rate in thickness, and a pattern having a tapered-angle at the cross section. The coating solution can be used for forming an insulating layer in displays or in other suitable applications.
申请公布号 US2005282958(A1) 申请公布日期 2005.12.22
申请号 US20040868821 申请日期 2004.06.17
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 JENG JYH-LONG;KING JINN-SHING;LU CHARNG-SHING
分类号 C08K3/00;C08K5/42;(IPC1-7):C08K3/00 主分类号 C08K3/00
代理机构 代理人
主权项
地址