发明名称 |
Wafer inspection system and method thereof |
摘要 |
A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.
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申请公布号 |
US2005282299(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20050132352 |
申请日期 |
2005.05.19 |
申请人 |
KIM KWANG-SOO;SHIN KOUNG-SU;CHOI SEUNG-MIN;JEONG YU-HAN |
发明人 |
KIM KWANG-SOO;SHIN KOUNG-SU;CHOI SEUNG-MIN;JEONG YU-HAN |
分类号 |
H01L21/66;G01R31/26;G01R31/28;G06F19/00;G06T7/00;(IPC1-7):G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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