发明名称 |
CMP formulations |
摘要 |
CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respectively and optionally an organic carboxylic acid.
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申请公布号 |
US2005279030(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20050198365 |
申请日期 |
2005.08.05 |
申请人 |
SAINT-GOBAIN CERAMICS & PLASTICS, INC. |
发明人 |
WARD DOUGLAS EDWIN;SOLOMOS DAVID PETER |
分类号 |
B24B37/00;B24B1/00;B24B37/04;B24D3/02;C09G1/02;C09K3/14;C22C19/03;G11B5/84;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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