发明名称 PARTIAL FORMATION METHOD FOR THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a partial formation method for a thin film solving a problem that a correction ink overflows from a recessed part, i.e., a correction portion and correction cannot be performed in the correction of the thin film by ink jet and previously performing liquid repellent treatment of the whole surface of a substrate in order to suppress overflowing from the recessed part. SOLUTION: After a wider area than the correction position including a foreign matter 6 on an insulation layer 5 such as TFT liquid crystal panel is previously coated with an ink for pre-treatment by an ink jet head 1 to form a pre-treatment coating part 7, the position to be corrected is removed to form the recessed part 8. Thereafter, recessed part 8 is coated once or several timed with the correction ink by the ink jet head 1 to required film thickness to form a correction coating part 9. Since the pre-treatment ink has high liquid repellent property relative to the correction ink, the liquid repellent property of a peripheral part formed with the thin film can be controlled by the previously coated pre-treatment ink and spreading of the correction ink is controlled to form the thin film at a desired portion. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005349256(A) 申请公布日期 2005.12.22
申请号 JP20040170142 申请日期 2004.06.08
申请人 SHARP CORP 发明人 MATSUDA TAKESHI
分类号 B05D1/38;B05D1/26;(IPC1-7):B05D1/38 主分类号 B05D1/38
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