发明名称 |
EMBEDDED CAPACITORS USING CONDUCTOR FILLED VIAS |
摘要 |
Embedded capacitors and a method for manufacturing the embedded capacitors. The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material (250) to form a first electrode (470). A conductor (360) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode. |
申请公布号 |
WO2005099028(A3) |
申请公布日期 |
2005.12.22 |
申请号 |
WO2005US10300 |
申请日期 |
2005.03.28 |
申请人 |
HARRIS CORPORATION |
发明人 |
PROVO, TERRY;THOMSON, ANDREW, J. |
分类号 |
H01G4/20;H01G4/26;H01L21/425;H01L21/4763;H01L21/8242;H01L23/498;H01P3/06;H05K1/16;H05K3/40;H05K3/46 |
主分类号 |
H01G4/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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