发明名称 |
PHENYLNAPHTHYLIMIDAZOLES FOR USE ON COPPER SURFACES DURING SOLDERING |
摘要 |
<p>A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.</p> |
申请公布号 |
WO2005121101(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
WO2005JP10898 |
申请日期 |
2005.06.08 |
申请人 |
SHIKOKU CHEMICALS CORPORATION;HIRAO, HIROHIKO;KIKUKAWA, YOSHIMASA;MURAI, TAKAYUKI |
发明人 |
HIRAO, HIROHIKO;KIKUKAWA, YOSHIMASA;MURAI, TAKAYUKI |
分类号 |
B23K1/00;B23K35/00;C07D233/54;C23C22/52;C23F11/14;H05K3/28;H05K3/34;(IPC1-7):C07D233/58 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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