| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact communications device module whose bond strength between its antenna putt and bud is enhanced by forming the joint in a ruggedness shape. <P>SOLUTION: When an antenna pad 6 and the pad 2 of a chip 1 formed on an antenna substrate 4 are connected by a flip-chip method using a bump 3, the foregoing bump is in a concavo-convex shape, and the bump and the antenna putt are mutually clenched at this ruggedness joint. Due to this bonding in the ruggedness shape, the bond strength of the joint part can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
