| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method for preventing copper-remaining phenomenon in which copper particles remain at the side of a base from being generated when forming wiring by etching, without decreasing the adhesive strength between the copper foil and the resin base. SOLUTION: For an acid copper-plating bath with copper sulfate and sulfuric acid as main constituents, a plating bath is used in which at least one metal selected from among iron, nickel, cobalt, molybdenum, tungsten, titanium, and aluminum and gelatin as an organic compound are added. An arborescent copper electrolytic deposition layer is formed by performing electrolytic treatment at a current value exceeding the limiting current density to the side of a surface to be adhered in copper foil, and electrolytic treatment is applied to the copper foil, in which the arborescent copper electrolytic deposition layer is formed at a current value less than the limiting current density, thus making the arborescent copper change into bump-like copper. COPYRIGHT: (C)2006,JPO&NCIPI
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