发明名称 SOLDERING EQUIPMENT INCLUDING RADIOSCOPY CAMERA
摘要 PROBLEM TO BE SOLVED: To provide soldering equipment including a radioscopy camera ensuring heat resistance even in a high temperature environment of about 250°C for melting solder. SOLUTION: The soldering equipment comprises a heating furnace (20) for taking in and out a soldering object (10), a means (30) for irradiating the object (10) with X-rays, a radioscopy camera (40) for photographing the object (10) irradiated with X-rays by the X-ray irradiating means (30), and heat resistant partition walls (51-53) arranged between the X-ray irradiating means (30) or the radioscopy camera (40) and the object (10) and transmitting X-rays. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005353712(A) 申请公布日期 2005.12.22
申请号 JP20040170743 申请日期 2004.06.09
申请人 OKUHARA ELECTRIC INC;UNI-HITE SYSTEM CORP 发明人 OKUHARA HIROSHI;HIRASHIMA RYUSUKE
分类号 B23K1/00;B23K1/008;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
代理机构 代理人
主权项
地址