发明名称 |
SOLDERING EQUIPMENT INCLUDING RADIOSCOPY CAMERA |
摘要 |
PROBLEM TO BE SOLVED: To provide soldering equipment including a radioscopy camera ensuring heat resistance even in a high temperature environment of about 250°C for melting solder. SOLUTION: The soldering equipment comprises a heating furnace (20) for taking in and out a soldering object (10), a means (30) for irradiating the object (10) with X-rays, a radioscopy camera (40) for photographing the object (10) irradiated with X-rays by the X-ray irradiating means (30), and heat resistant partition walls (51-53) arranged between the X-ray irradiating means (30) or the radioscopy camera (40) and the object (10) and transmitting X-rays. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005353712(A) |
申请公布日期 |
2005.12.22 |
申请号 |
JP20040170743 |
申请日期 |
2004.06.09 |
申请人 |
OKUHARA ELECTRIC INC;UNI-HITE SYSTEM CORP |
发明人 |
OKUHARA HIROSHI;HIRASHIMA RYUSUKE |
分类号 |
B23K1/00;B23K1/008;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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地址 |
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