| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an electronic circuit and an MEMS on different substrates, to electrically bond the wiring circuit electrodes of the substrates, and to integrate both the substrates simultaneously. SOLUTION: A method for manufacturing the substrates having a bump has a process for preparing a first substrate in which a plastically deformed material is filled into a groove for forming the bump, and a second substrate having a pad containing the plastically deformed material; a process for overlapping the surface of the first substrate in which the plastically deformed material is filled and the surface of the second substrate having the pad so that they oppose each other, applying a load to both the substrates, and bonding the plastically deformed material to the pad; and a process for transferring the plastically deformed material filled into the groove to the second surface by peeling off the first and second substrates, and forming the bump on the second substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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