发明名称 EXTRA-FINE PLATED WIRE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an extra-fine plated wire manufacturing method capable of efficiently manufacturing an extra-fine plated wire by suppressing generation of metal powder attributable to a plating layer. SOLUTION: In the extra-fine plated wire manufacturing method in which a plated copper or copper alloy wire is drawn by a die 10, the wire is drawn before the wire diameter reaches≤0.05 mm by setting the die bearing pressure which is the drawing force divided by the contact area of the wire with an inner face of the die to be≤1.47×10<SP>2</SP>MPa, the die angle (2α) to be 6-10°, and the reduction rate of area to be 5-15%, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005349467(A) 申请公布日期 2005.12.22
申请号 JP20040176228 申请日期 2004.06.14
申请人 FUJIKURA LTD 发明人 YAMADA TSUYOSHI;MIMURA SHOJI;SAITO TAKASHI
分类号 B21C1/00;B21C3/02;C25D7/06;(IPC1-7):B21C1/00 主分类号 B21C1/00
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