发明名称 Method of manufacturing semiconductor device
摘要 A method of manufacturing a semiconductor device includes forming a gate electrode on a semiconductor substrate, forming a resist on the semiconductor substrate so that the resist contacts only one side face of the gate electrode, and tilting the gate electrode by shrinking or expanding the resist.
申请公布号 US2005282320(A1) 申请公布日期 2005.12.22
申请号 US20040986225 申请日期 2004.11.12
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HASUIKE ATSUSHI
分类号 H01L21/285;H01L21/338;H01L29/423;H01L29/812;(IPC1-7):H01L21/338 主分类号 H01L21/285
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