发明名称 |
Micro-etching method to replicate alignment marks for semiconductor wafer photolithography |
摘要 |
A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and, applying a wet etchant to cover a targeted etching portion of the process surface while excluding an adjacent surrounding area to selectively etch the material layer overlying the targeted etching portion.
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申请公布号 |
US2005282396(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20040872238 |
申请日期 |
2004.06.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN YU-LIANG;LO HENRY;CHANG CHUNG-LONG;HUANG GORGE;LU TONY;YEH GNESH;LIANG CANDY;LIN CHUN-HSIEN;ZHOU MEI SHENG;WU SUNNY;LIU AI-SEN;HUANG CHENG-LIN;CHEN LI-JUI;WANG SHIH C. |
分类号 |
H01L21/00;H01L21/302;H01L21/311;H01L21/336;H01L21/461;H01L23/544;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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