发明名称 |
A BARRIER LAYER FOR A PROCESSING ELEMENT AND A METHOD OF FORMING THE SAME |
摘要 |
In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
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申请公布号 |
KR20050120681(A) |
申请公布日期 |
2005.12.22 |
申请号 |
KR20057018488 |
申请日期 |
2004.03.18 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
ESCHER GARY;ALLEN MARK A. |
分类号 |
H01J37/32;(IPC1-7):H01L21/205 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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