发明名称 ELECTRICALLY CONDUCTIVE PASTE COMPOSITE FOR MULTI-LAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide thermosetting property electrically conductive paste composite used for a multi-layer wiring board with which sufficient wiring board reliability about moisture absorption reflow thermal resistance, resistance value and so on can be secured, even if the paste composite is used as electrically conductive wiring in internal layers on outer layers and in viaholes of a collective multi-layer wiring board of which insulating base members are made of crystalline thermoplastic resin. SOLUTION: The electrically conductive paste composite is used for the multi-layer wiring board which is formed by collective lamination using thermal fusion of wiring boards having the electrically conductive paste composite on surfaces and in the viaholes of the insulating base members made of crystalline thermoplastic resin composite. The electrically conductive paste composite contains electrically conductive powder and resin mixture including epoxy resin and curing agent. Curing peak temperature of the resin mixture is equal to crystalline thermoplastic resin composite glass transition temperature (Tg) -15°C or more and less than crystalline peak temperature (Tc) of the crystalline thermoplastic resin composite. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005353387(A) 申请公布日期 2005.12.22
申请号 JP20040172067 申请日期 2004.06.10
申请人 MITSUBISHI PLASTICS IND LTD;KYOTO ELEX KK 发明人 YAMADA SHINGETSU;SUZUKI TAKANOBU;MORISHIMA NOBUAKI
分类号 H05K1/09;H01B1/22;H01B1/24;H05K3/46;(IPC1-7):H01B1/22 主分类号 H05K1/09
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