THERMOSETTING POLYMER BONDING FOR MICRO ELECTRO-MECHANICAL SYSTEMS

摘要

A method of bonding a pair of members (20, 30) together to form a microdevice, by: applying a layer of uncured thermosetting polymer (12) onto a first member (10); placing a second member (20) onto the first member (10); removing the second member (20) from the first member (10), thereby transferring portions of the uncured thermosetting polymer (12) from the first member (10) onto the second member (20); placing the second member (20) onto a third member (30); and then thermally curing the thermosetting polymer (12), thereby bonding the second member (20) to the third member (30).