发明名称 |
POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING PATTERN USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition having high sensitivity and high resolution and satisfying both of a preferable pattern feature and preferable PED (post exposure delay) characteristics in vacuum, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition contains: (A) a resin which is insoluble or hardly insoluble with an alkali aqueous solution and is changed into soluble with an alkali aqueous solution by the effect of an acid; (B) a compound which generates an acid by irradiation with actinic rays or radiation; and (C) an organic basic compound. The composition contains a resin (A1) having a repeating unit of the structure expressed by general formula (1) and another resin (A2) as the resins of the component (A). The method for forming a pattern is carried out by using the above composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005352337(A) |
申请公布日期 |
2005.12.22 |
申请号 |
JP20040175091 |
申请日期 |
2004.06.14 |
申请人 |
FUJI PHOTO FILM CO LTD |
发明人 |
SHIRAKAWA KOJI;SASAKI TOMOYA |
分类号 |
G03F7/039;C08F12/24;G03C1/492;G03F7/004;G03F7/033;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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