发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING PATTERN USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition having high sensitivity and high resolution and satisfying both of a preferable pattern feature and preferable PED (post exposure delay) characteristics in vacuum, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition contains: (A) a resin which is insoluble or hardly insoluble with an alkali aqueous solution and is changed into soluble with an alkali aqueous solution by the effect of an acid; (B) a compound which generates an acid by irradiation with actinic rays or radiation; and (C) an organic basic compound. The composition contains a resin (A1) having a repeating unit of the structure expressed by general formula (1) and another resin (A2) as the resins of the component (A). The method for forming a pattern is carried out by using the above composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005352337(A) 申请公布日期 2005.12.22
申请号 JP20040175091 申请日期 2004.06.14
申请人 FUJI PHOTO FILM CO LTD 发明人 SHIRAKAWA KOJI;SASAKI TOMOYA
分类号 G03F7/039;C08F12/24;G03C1/492;G03F7/004;G03F7/033;H01L21/027 主分类号 G03F7/039
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