| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is connectable, if a tape bump material and an electrode pad material are likely to produce an intermetallic compound therebetween, and the tape bump surface slants or tape bumps are misaligned from electrode pads. <P>SOLUTION: A tape bump 3 to be connected to one electrode pad 5 is composed of a plurality of bumps, this facilitating connecting the electrode pad 5 to the tape bump 3. Thus, the semiconductor device is connectable, if the material of the tape bump 3 and the material of the electrode pad 5 are likely to produce an intermetallic compound therebetween, and the surface of the tape bump 3 slants or tape bumps 3 are misaligned from the electrode pads 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
