| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package manufacturing method wherein conductivity is uniformly established free from constrains imposed by a specified structure for all through holes intended to turn conductive, no superficial irregularities or internal voids occur, and the conductivity is established by utilizing existing facilities in a simplified way, in a short time, and at a low cost. SOLUTION: The semiconductor package manufacturing method includes a process of making conductive a through hole 10 on an electronic circuit board 12. Further, the process comprises a step wherein a conductor is pressed into the through hole 10 by using a ball bonder, and a step wherein the exposed head of the conductor pressed into the through hole 10 is flattened by coining. COPYRIGHT: (C)2006,JPO&NCIPI |
