| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the number of via holes dedicated to interlayer connection, to reduce man hours for manufacturing a substrate having a built-in electronic part, and to enhance the density of electronic part integration. <P>SOLUTION: Interlayer connecting conductors 16 and 17 are provided on the surfaces of the end faces 12 and 13 of a package body 11 formed of an insulating resin, and they electrically connect the electrode conductors 14 and 15, intended to connect to circuits, to both end faces 12 and 13 of the package body 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
