| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket capable of conducting electric characteristic inspection with the same electric characteristic, by using in common the socket used in the electric characteristic inspection under an integrally formed condition of a wafer level CSP package or the like, and debugging work in a separate piece or the like. SOLUTION: A projected protrusion 13 of a size same to a cutting pitch 24 when cut into respective semiconductor elements 21b is provided only in a portion of a measured object 21a, in a housing 1, to prevent the respective semiconductor elements 21b from interfering with the housing 1, and a contact pin 2 is provided inside the projected protrusion 13. A hole having a size slightly larger than the cutting pitch 24 is provided to be fixed engagement-positionedly to the housing 1, in a device guide 3. A presser 4 of the measured object 21a under a separate piece condition is hooked to a groove 14 provided only in the device guide 3, to be pressed from an upper side, the the socket used in the electric characteristic inspection and the debugging work in the separate piece or the like is thereby used in common, under the condition where the housing 1 is attached to a circuit board 9 for inspection, so as to allow switching easily. COPYRIGHT: (C)2006,JPO&NCIPI
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