发明名称 |
Heat spreader in integrated circuit package |
摘要 |
An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises a hole through a portion thereof. The IC die and the wire bond are disposed substantially between the heat spreader and the package substrate.
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申请公布号 |
US2005281011(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20040873387 |
申请日期 |
2004.06.22 |
申请人 |
LIM HONG T;OTHIENO MAURICE O;LOW QWAI H |
发明人 |
LIM HONG T.;OTHIENO MAURICE O.;LOW QWAI H. |
分类号 |
H01L23/31;H01L23/433;H05K1/18;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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