| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealing semiconductor device preventing the deterioration of heat-dissipating properties and having even excellent shielding characteristics in the semiconductor device coated with a packaging resin having an uneven shape. <P>SOLUTION: In the resin sealing semiconductor device 1 in a form in the operation, a semiconductor bare chip 6 coated with an epoxy resin 9, and a surface mounting part 8 such as a chip capacitor; a chip resistor or the like are mounted on a specified wiring pattern on a glass epoxy board 10, and the packaging resin 12 for an insulation protection is formed on a lead terminal 13 and the board containing these parts. An aluminum plate 2 with an opening section is fitted around the packaging resin 12, and the inwall section of the aluminum plate 2 is coated with a resin 4 having a high elasticity and a high thermal conductivity. The resin 4 is buried between the aluminum plate 2 and the packaging resin 12 when the board 10 sealed with the packaging resin 12 is inserted from the opening section. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
