STRUCTURE, MANUFACTURING METHOD THEREOF, AND BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for bonding minute (micro) electrodes provided on substrates, namely the electrodes between a bump and a pad by bonding the substrates. SOLUTION: The method for manufacturing the substrate in which an electrode bump is formed has a process for preparing the substrate in which the electrode bump is formed, and a process for pressing the electrode bump by a flat board and making the surface of the electrode bump hemispherical. COPYRIGHT: (C)2006,JPO&NCIPI