| 摘要 |
PROBLEM TO BE SOLVED: To realize the processing of a substrate, especially the coating of the substrate at a high throughput with stable positive method, while satisfying a quality parameter required for the substrate processed. SOLUTION: While a plurality of processing devices are disposed on a rotator, an annular position can be established adjustably in accordance with the present rotating speed of the rotator with relation to a plurality of process phases in accordance with those annular positions on the rotator, namely, at least one process phase having passed through the introduction of at least one substrate to the processing device and the processing of the substrate and the taking-out of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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