发明名称 |
Retaining ring with conductive portion |
摘要 |
A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
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申请公布号 |
US2005282322(A1) |
申请公布日期 |
2005.12.22 |
申请号 |
US20050127790 |
申请日期 |
2005.05.11 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MANENS ANTOINE P.;SHRAUTI SURESH;DUBOUST ALAIN;WANG YAN;CHEN LIANG-YUH |
分类号 |
B23H5/08;B24B1/00;B24B7/19;B24B7/30;B24B37/34;H01L21/302;H01L21/336;H01L21/461;H01L21/8234;(IPC1-7):B24B1/00;H01L21/823 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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