发明名称 Retaining ring with conductive portion
摘要 A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
申请公布号 US2005282322(A1) 申请公布日期 2005.12.22
申请号 US20050127790 申请日期 2005.05.11
申请人 APPLIED MATERIALS, INC. 发明人 MANENS ANTOINE P.;SHRAUTI SURESH;DUBOUST ALAIN;WANG YAN;CHEN LIANG-YUH
分类号 B23H5/08;B24B1/00;B24B7/19;B24B7/30;B24B37/34;H01L21/302;H01L21/336;H01L21/461;H01L21/8234;(IPC1-7):B24B1/00;H01L21/823 主分类号 B23H5/08
代理机构 代理人
主权项
地址