发明名称 Printed circuit boards and methods for fabricating the same
摘要 Printed circuit boards and methods for fabricating the same. A via in a printed circuit board electrically connects to trace lines of the PCB, such that only one plating line is required to electrically connect a plating bus and the plating through hole. Thus, in an electroplating step, current can flow to fingers in the trace lines to plate an anti-oxidation metal layer thereon. The via is separated into several sub-vias to electrically isolate the plating line from trace lines and fingers, each of which connects to the plating line or the trace lines. Finally, at least one plating line remains, thus avoiding negative impact on electrical performance of an electronic device that uses the printed circuit board.
申请公布号 US2005282314(A1) 申请公布日期 2005.12.22
申请号 US20050150346 申请日期 2005.06.13
申请人 ADVANCED SEMICONDUCTOR ENGINEERING INC. 发明人 LO KUANG-LIN;FANG JEN-KUANG
分类号 H01L21/44;H05K3/24;H05K3/40;H05K3/42;(IPC1-7):H01L21/44 主分类号 H01L21/44
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