发明名称 |
Metallmatrix-Verbundmaterial, Verfahren zu seiner Herstellung und seine Verwendung |
摘要 |
Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol.% cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300 DEG C of from 5 x 10<-6> to 17 x 10<-6>/ DEG C and a thermal conductivity of 100 to 380 W/m . k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article. |
申请公布号 |
DE60017304(T2) |
申请公布日期 |
2005.12.22 |
申请号 |
DE2000617304T |
申请日期 |
2000.03.03 |
申请人 |
HITACHI, LTD. |
发明人 |
OKAMOTO, KAZUTAKA;KONDO, YASUO;ABE, TERUYOSHI;AONO, YASUHISA;KANEDA, JUNYA;SAITO, RYUICHI;KOIKE, YOSHIHIKO |
分类号 |
C22C1/05;B22F1/00;C22C1/10;C22C9/00;C22C29/12;C22C32/00;C22F1/08;H01L23/14;H01L23/34;H01L23/373;H01L23/433;H01L25/07 |
主分类号 |
C22C1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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