HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION, HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION FOR BUILD-UP TYPE MULTILAYER BOARDS, PREPREGS, COPPER-CLAD LAMINATES, PRINTED WIRING BOARDS, RESIN FILMS WITH COPPER FOIL OR CARRIERS, AND BUILD-UP TYPE LAMINATES AND MULTILAYER BOARDS

摘要

A halogen-free nonflammable epoxy resin composition, which comprises, as essential components (A) at least one kind of a cross-linked phenoxyphosphazene compound, (B) at least one kind of polyepoxide compound such as bisphenol A epoxy resin, (C) a curing agent for epoxy such as bisphenol A novolac resin, and (D) a cure promoter for epoxy, wherein the epoxy resin composition further comprises 0 to 50% by weight of an inorganic filler.