Laminated electronic part and its manufacturing method

摘要

[PROBLEMS] A laminated electronic part and its manufacturing method in which air is prevented from entering at the interface between a ceramic substrate and a resin layer and therefore the resin layer does not separate from the ceramic substrate. [MEANS FOR SOLVING PROBLEMS] A ceramic substrate (1A) having a first groove (7a) extending to an edge surface in one major surface and a resin sheet (10A) containing a thermo-curing resin in a semi cured state are prepared. The resin sheet (10A) is so compression-bonded to the one major surface of the ceramic substrate (1A) as to cover the first groove (7a). A composite laminate is fabricated by thermo-curing the resin sheet. In compression-bonding the resin sheet (10A), air confined at the interface with the ceramic substrate (1A) is exhausted outside through the first groove (7a). The composite laminate is split into pieces along the first groove (7a). An external terminal electrode (11) is formed on the outer surface of the resin layer (10) of each piece.