Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor

摘要

The aim of the disclosed invention is to provide a capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attains extremely low resistance and low inductance involved in connection between an IC chip and the capacitor and to provide a printed wiring substrate and a capacitor used in the same. To achieve this object, a capacitor-built-in-type printed wiring substrate (100) on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate (110) and an IC chip (101) mounted on the capacitor-built-in-type printed wiring substrate (110). A printed wiring substrate (120) includes a number of connection-to-IC substrate bumps (152) and a closed-bottomed capacitor accommodation cavity (121) formed therein. A capacitor (130) is disposed in the cavity (121) and includes a pair of electrode groups (133E and 133F) and a number of connection-to-IC capacitor bumps (131) connected to either one of the paired electrode groups (133E and 133F). The connection-to-IC capacitor bumps (131) are flip-chip-bonded to corresponding connection-to-capacitor bumps (103) on the IC chip. The connection-to-IC substrate bumps (152) are flip-chip-bonded to corresponding connection-to-substrate bumps (104) on the IC chip.