| 发明名称 |
INTRINSICALLY HEATABLE PRESSURE-SENSITIVE ADHESIVE PLANAR STRUCTURES |
| 摘要 |
<p>An electrically heatable adhesive composition (I) comprises: (a) at least one adhesive component and; (b) at least one electrically conductive filler. An independent claim is included for a process for the production of the composition (I) by preparation of the adhesive component (A) by at least partial polymerization of a monomer, optionally in the presence of a comonomer with addition of the filler (B) before or after polymerization.</p> |
| 申请公布号 |
EP1606368(A1) |
申请公布日期 |
2005.12.21 |
| 申请号 |
EP20040712016 |
申请日期 |
2004.02.18 |
| 申请人 |
TESA AG |
发明人 |
KEITE-TELGENBUESCHER, KLAUS;ZOELLNER, STEPHAN;KUPSKY, MARCO;PATINO, GERMAN;GOERBIG, OLAF |
| 分类号 |
B60R1/06;C08L33/00;C09J7/00;C09J9/02;C09J11/04;C09J133/06;H01C7/02;(IPC1-7):C09J201/00;H05B6/02;H05B6/80;H05B6/10;H05B3/84 |
主分类号 |
B60R1/06 |
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