发明名称 |
ELECTRONIC COMPONENT COMPRISING A SEMICONDUCTOR CHIP AND A PLASTIC HOUSING, AND METHOD FOR PRODUCING THE SAME |
摘要 |
The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component. |
申请公布号 |
EP1606841(A2) |
申请公布日期 |
2005.12.21 |
申请号 |
EP20040718612 |
申请日期 |
2004.03.09 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HAGEN, ROBERT-CHRISTIAN;JEREBIC, SIMON |
分类号 |
H01L21/56;H01L23/31;H01L29/06;(IPC1-7):H01L23/31 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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