Conductive base material with resistance layer and circuit board material with resistance layer

摘要

A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 mu m and the resistance layer of Ni alloy layer containing at least 8 to 18 wt% of P is formed on the roughening treated side.