Heat sink with visible logo

摘要

A heat sink is for an element to be cooled has a thermally conductive base (20) and a plurality of thermally conductive pins (24) or fins extending substantially perpendicular from the base (20), said pins (24) or fins being arranged in a predetermined pattern. The pins (24) at least partially frame thermally conductive projections extending substantially perpendicular from said base (20) which forming a discernable logo (26) having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo (26) performs cooling of the components within a package.