| 摘要 |
Disclosed is a wiring board including a first polyimide layer (12) of heat-cured photosensitive polyimide, a copper layer pattern (15) formed by growing an electrolytic copper plating layer on the polyimide layer, and a second polyimide layer (16) of heat-cured photosensitive polyimide, the second polyimide layer covering the copper layer pattern. Also, disclosed is a magnetic disc apparatus including this wiring board (37), a head carriage (33) having an electric connection to the wiring board and having a head (34) mounted thereon to perform input/output of electric signals transmitted bilaterally via the connection, and a magnetic disc (31) on which reading/writing of magnetic information are performed by the head mounted on the head carriage. <IMAGE> |
