发明名称 Electronic assembly packaging
摘要 The present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.
申请公布号 US6977337(B1) 申请公布日期 2005.12.20
申请号 US20040869729 申请日期 2004.06.16
申请人 VISTEON GLOBAL TECHNOLOGIES, INC. 发明人 SATULLO ANTHONY NICOLO;BELKE ROBERT E.;ZHOU HONG;JETT DIANE M.;MOHR BERTRAND R.;TRUBLOWSKI JOHN;SCHULKE MICHAEL S.;SCHUBRING ADAM W.
分类号 H01J5/00;H01L23/28;H05K5/04;H05K7/20;H05K9/00;(IPC1-7):H01L23/28 主分类号 H01J5/00
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